In this talk, we present preliminary results from a survey of more than 30 devices that incorporate tamper-sensing meshes. We begin with a short background on tamper-sensing meshes from the 1800s to now. We will provide a brief explanation of the industry standards as well as the technical trade-offs that drive mesh design. With this background, using real-world examples, we provide a comprehensive overview over mesh construction techniques and their limitations. We will show results of an examination of substrate materials, trace materials, patterning techniques, and three-dimensional assembly styles. Based on our findings, we propose a list of criteria for the design of secure tamper-sensing meshes. We observe that for academic research on meshes, off-the-shelf PCB manufacturing processes provide a reasonable stand-in for actual meshes seen in the wild. We find that real-world meshes are commonly created using PCB or FPC processes, and using structure sizes of 0.5 mm or larger. We find that using simple construction approaches based on off-the-shelf processes such as the silkscreen process used for printed keyboard membranes, meshes can be created that match or exceed the security offered by a large majority of real-world meshes.